Ti-Cu Seed layer In line Vacuum Sputtering Equipment

The metallization process in traditional semiconductor packaging is used chemical copper plating with copper electroplating. Due to the need for fine line, it has the problem of poor film adhesion, so the demand for titanium copper sputtering has arisen accordingly.

UVAT has long-term experience and technology in metal sputtering, including mechanical design, process parameters, and thin film performance development. The key technical modules of this product include high-temperature degas intelligent system, low-temperature of PVD intelligent monitoring system, pre-clean (pretreatment) system, particle suppression system, titanium copper sputtering technology and optimization of titanium copper process parameters.

We have high-performance machine to enter into the fan-out wafer size packaging (FOWLP) market. The FOPLP has a significant benefit in reducing the process cost and increase using efficiency area by its large carrier area, which is the development trend of the FOPLP process.